High Performance Materials
High heat resistant thermosetting resins:
Original epoxide, High heat resistance, Low viscosity, Filler high filling
Characteristics
- High heat resistance due to original epoxide
- When the temperature is raised, it becomes liquid and has low viscosity.
- High filling of filler due to low viscosity
- Low coefficient of thermal expansion and high thermal conductivity due to high filling of filler
Physical property comparison with traditional epoxy resin
Traditional resin | XR0004 | XR0016 | XR0014 | XR0020 | |
---|---|---|---|---|---|
Main resin (Epoxide) | Biphenyl etc. | ENEOS resin [Low viscosity] |
ENEOS resin [High Tough] |
ENEOS resin [Low Temp. cure] |
ENEOS resin [Low Temp. cure2] |
Hardner | Phenol | ||||
Property | |||||
Viscosity@100degC [Pa・sec] |
>5 | 0.3 | 0.8 | 0.8 | 0.9 |
F. Strength*[MPa] | 150 | 124 | 155 | 140 | 138 |
F. Modulus*[MPa] | 3000 | 4820 | 3800 | 4400 | 4060 |
Tg(175℃5h)[℃] | <200 | - | - | 190 | 210 |
Tg(220℃5h)[℃] | <220 | 240 | 220 | 240 | 250 |
- Post cure condition:100℃2min → 180℃1h → 220℃5h
Applications: Thermosetting compound
Feel free to inquire