High Performance Materials

High heat-resistant thermosetting resinR&D product

Sample of high heat-resistant thermosetting resin
  • Combining epoxide and curing agent, this product achieves both high heat resistance and low viscosity.
  • By loading a large amount of filler, it is possible to achieve low linear expansion in a broad range of temperatures.
  • A standard type and low temperature cure type are available.
  • Filler is not included in this material.


Characteristics of resin

Standard type Low temperature cure type
Flexural strength MPa 120 140
Flexural modulus MPa 4900 4400
Flexural strain % 2.6 3.5
Coefficient of thermal expansion ppm/K 49.7 54.7
Glass transition temperature 256 247
  • Curing conditions: 100℃ 2min → 180℃ 2h → 240℃ 4h
Example of application: molding compound
  1. 1This material is a development product.
  2. 2These Data are current as of October 2017. For improvement purposes, changes may be made without notice.
  3. 3These data are typical, not guaranteed.

Feel free to inquire

High Performance Materials Company, HPM Business Promotion Dept., HPM Business Promotion Group #2

Esso and Mobil are trademarks of Exxon Mobil Corporation, used under license.